产品型号

Product specification

产品体系

Product Series

粘度 viscosity

mpa.s

建议使用温度 Recommended operating temperature （ ℃）

产品应用

Product application

LE-5173

PUR

5500 ± 1 000

(110 ℃ )

110-130

用于手机、笔记本电脑、平板电脑、液晶显示屏、导航仪、电子书和数码产品等电子产品元器件及结构的密封粘结

Used to seal and bond components and structures of electronic products such as mobile phones, laptops, tablets, liquid crystal displays, navigators, e-books and digital products

LE-5174

PUR

1800 ± 2000

(60 ℃ )

25-35

粘度小，出胶流畅、开放时间长、不需要加热 常温即可使用 等特点。用于耳机、喇叭、电子标签等。

The viscosity is small, the glue flows smoothly, the opening time is long, Can be used at room temperature without heating. Used for earphones, speakers, and electronic labels.

LE-9801

PUR

3000 ± 1000

(80 ℃ )

60-100

主要针对 FPC 柔性线路板的 聚亚醯胺 (PI) 或聚酯类（ PE ）膜材复合铜箔 专门设计开发 .

特别设计和开发。

Specially designed and developed for FPC flexible circuit boards polyimide (PI) or polyester (PE) film materialscomposite copper foil

LE-P51

双组份

聚氨酯

Tow -components

polyurethane

4 ： 1 混合粘度

Mix Viscosity

1000 ± 3 00

(23 ℃）

25-35

具有很 好的绝缘防潮性能，适合电子电器元器件和线路板的封装密封

It has good insulation and moisture-proof performance, suitable for the packaging and sealing of electronic and electrical components and circuit boards